Volume 16 (2025)
Volume 15 (2024)
Volume 14 (2023)
Volume 13 (2022)
Volume 12 (2021)
Volume 11 (2020)
Volume 10 (2019)
Volume 9 (2018)
Volume 8 (2017)
Volume 7 (2016)
Volume 6 (2015)
Volume 5 (2014)
Volume 4 (2013)
Volume 3 ( 2012)
Volume 2 (2011)
Volume 1 (2010)
Low Resistance and High Electromigration Lifetime of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper

Jing-Ye Juang; Kai Cheng Shie; Yu Jin Li; K. N. Tu; Chih Chen

Volume 12, Issue 8 , August 2021, , Pages 1-4

https://doi.org/10.5185/amlett.2021.081654

Abstract
  Cu-to-Cu joints of 30 mm in diameter were fabricated using (111)-oriented nanotwinned copper at 300 °C for 20 min in N2 ambient. The joints possess excellent electrical properties. The average resistance and specific contact resistivity are 4.1 mΩ and 3.98 × 10 -8 Ω·cm 2 ...  Read More

Isothermal aging characteristics of rare earth magnesium hexaaluminate based advanced thermal barrier coatings

Premanshu Jana; Santanu Mandal;Koushik Biswas; Ponnarassery S Jayan

Volume 9, Issue 5 , May 2018, , Pages 375-382

https://doi.org/10.5185/amlett.2018.1674

Abstract
  The isothermal aging characteristics of rare earth magnesium hexaaluminate (REMHA) based thermal barrier coatings (TBC) such as lanthanum magnesium hexaaluminates (LMHA), Neodymium doped LMHA (LNMHA) and LNMHA-Yttrium aluminium garnet (YAG) composite were evaluated at 1400 °C and compared with standard ...  Read More

Isothermal aging characteristics of rare earth magnesium hexaaluminate based advanced thermal barrier coatings


Crystallization And Grain Growth Behavior Of La2O3-doped Yttria-stabilized Zirconia

Bulent Aktas; Suleyman Tekeli; Serdar Salman

Volume 5, Issue 5 , May 2014, , Pages 260-264

https://doi.org/10.5185/amlett.2014.amwc1011

Abstract
  The effect of La2O3 addition on the microstructure and grain growth behavior of yttria-stabilized zirconia (8YSZ) was investigated. To this end, 8YSZ was doped with 1–15 wt% La2O3 by means of colloidal processing, and then sintered at 1550 °C for 1 h. XRD results identified a dissolution limit ...  Read More