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Low Resistance and High Electromigration Lifetime of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper

Jing-Ye Juang; Kai Cheng Shie; Yu Jin Li; K. N. Tu; Chih Chen

Volume 12, Issue 8 , August 2021, , Pages 1-4

https://doi.org/10.5185/amlett.2021.081654

Abstract
  Cu-to-Cu joints of 30 mm in diameter were fabricated using (111)-oriented nanotwinned copper at 300 °C for 20 min in N2 ambient. The joints possess excellent electrical properties. The average resistance and specific contact resistivity are 4.1 mΩ and 3.98 × 10 -8 Ω·cm 2 ...  Read More