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Resonance-Based Temperature Sensors using a Wafer Level Vacuum Packaged SOI MEMS Process

Gulsah Demirhan Aydin; Tayfun Akin

Volume 11, Issue 1 , January 2020, , Pages 1-8

https://doi.org/10.5185/amlett.2020.011462

Abstract
  This paper reports the development of resonance-based temperature sensors using a wafer level vacuum packaged SOI MEMS process which is normally used to implement various MEMS sensors, including MEMS gyroscopes and accelerometers. Implementing MEMS temperature sensors in such a MEMS process together ...  Read More

Resonance-Based Temperature Sensors using a Wafer Level Vacuum Packaged SOI MEMS Process